Welcome to Bulletin of Botanical Research! Today is Share:

Bulletin of Botanical Research ›› 2010, Vol. 30 ›› Issue (4): 468-472.doi: 10.7525/j.issn.1673-5102.2010.04.015

Previous Articles     Next Articles

Effect of Exogenous ABA and Silicon on Leaf Water Potential and Protective Enzyme Activities of Elaeagnus angustifolia L. Seedlings under Drought Stress

MUHTAR·Zari;QIMAN·Yunus*;NORIKAZU Yamanaka   

  1. 1.Xinjiang Agricultural University College of Forestry and Horticulture,Urumqi 830052;2.Arid Land Research Center Tottori University,Tottori 680-0001
  • Received:1900-01-01 Revised:1900-01-01 Online:2010-07-20 Published:2010-07-20
  • Contact: QIMAN·Yunus
  • Supported by:
     

Abstract: One year old Elaeagnus angustifolia L. seedlings were used to study the effect of exogenous abscisic acid and silicon on the leaf relative water content, leaf water potential, membrane relative permeability, MDA content, protective enzyme(SOD, CAT, APX) activities under 30 days drought stress(T2:SRWC=35%~40%). Results showed that: When the seedlings were under T2 drought stress, the leaf relative water content and water potential decreased ascompared to control seedling(ck), and the membrane relative permeability increased, and the E.angustifolia L.seedlings were injured to a certain extent. After using exogenous abscisic acid on the same treatment, the leaf relative water content and catalase(CAT) activity of E.angustifolia L.seedlings increased, and its membrane relative permeability and MDA content decreased significantly, and the leaf water potential decreased too, therefore, using of exogenous abscisic could alleviate the injury of E.angustifolia L.seedlings under drought stress. Meanwhile, after using exogenous silicon on the same treated seedlings, the superoxide dismutase activity was enhanced, and leaf relative water content increased, its leaf water potential reduced to a certain extent, thereby, exogenous silicon could diminish the harm of E.angustifolia L.seedlings, by T2 drought stress.

Key words: drought stress, exogenous abscisic acid, exogenous silicon

CLC Number: